Improving the efficiency of semiconductor technology
Less is More – More Energy from the Thinnest Wafers
A conventional wafer is 300 microns thick. Optimized techniques will make it possible in future to cut silicon wafers which are only 100 microns thick.
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More surface area from a block |
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Lowering costs by reducing wastage |
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Then, based on the data they have collected, they conduct experiments modeling the actual cutting process. With the help of a very fine diamond point – the nanoindentor – they create microcracks in silicon wafers and observe how these are formed and how they propagate in minute detail under an electron microscope. Only when these steps are completed will Wasmer be in a position to develop a concept for optimizing the cutting process. Wismer is sure that “the commercial significance will be quite considerable, since potentially it should be possible to save up to a third of the costs.” | ||||
Latest know-how for the industrial partner |
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Technology transfer – a win-win situation Editor Technical information |
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